Hochgeschwindigkeitsdiode und Verfahren zur Herstellung
In a semiconductor device a first diode having a pn junction and a second diode having a combination of a Schottky barrier and a pn junction in a current-passing direction are provided side by side in a direction perpendicular to the current-passing direction. When a forward current with a current d...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | In a semiconductor device a first diode having a pn junction and a second diode having a combination of a Schottky barrier and a pn junction in a current-passing direction are provided side by side in a direction perpendicular to the current-passing direction. When a forward current with a current density JF is passed into the second diodes, the relation is established in a forward voltage VF range of 0.1 (V) to 0.3 (V). The first diode is constituted by first and second semiconductor regions (13, 15) forming a pn junction therebetween, the second being in ohmic contact with one main electrode (3), and having an impurity concentration higher than that of the first semiconductor region (13). The second diode is constituted by first and third semiconductor regions (13, 16) forming a pn junction therebetween, the third being in contact through a Schottky barrier with the one main electrode (3) and having an impurity concentration higher than the first semiconductor region (13). |
---|