Halbleiterlaser, Halbleiter-Wafer und Verfahren zur Herstellung derselben

A semiconductor laser device and a method for the production of the semiconductor laser device are provided, which semiconductor laser device includes a striped channel (10) formed in a semiconductor substrate (1) through a current blocking layer (2) on the substrate (1) and at least two dummy grooves (20) formed in the current blocking layer (2) on each side of the striped channel (10). Also provided are a semiconductor wafer prepared for the purpose of producing optical devices with an optical waveguide, and a method for the production of the semiconductor wafer. The semiconductor wafer includes a semiconductor substrate (1), the surface of which has an orientation inclined from the [100] direction to one of the [011] and [011] directions by an angle theta satisfying the relationship 0.1o < ¦ theta ¦ < 4o; a plurality of striped channels (10) formed in the substrate (1) through a current blocking layer (2) in the direction of the other of the [011] and [011] directions; and at least one dummy side groove (30) formed between the striped channels (10), having a combined cross-sectional area on the plane perpendicular to the other direction greater than that of each of the striped channels.