Nasssätzung von ausgehärteten Polyimiden

Polyimide is etched by contacting the polyimide with an aqueous solution of a metal hydroxide followed by contact with an acid followed by contact with an aqueous solution of a metal hydroxide. Etching of chemically cured polyimide can be enhanced by employing a presoaking in hot water. Also, partia...

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Bibliographische Detailangaben
Hauptverfasser:	RITSKO, JOHN JAMES, MT. KISCO, N.Y. 10 549, US, FEGER, CLAUDIUS, WHITE PLAINS, N.Y. 10 605, US, MOLIS, STEVEN EARLE, YORKTOWN HEIGHTS, N.Y. 10 598, US, PAWLOWSKI, WALTER PAUL, ENDICOTT, N.Y. 13 760, US, GLENNING, JOHN JOSEPH, VESTAL, N.Y. 13 850, US, HOUGHAM, GARETH GEOFFREY, OSSINING, N.Y. 10 562, US, SLOTA, PETER, JR., VESTAL, N.Y. 13 850, US, SNYDER, RANDY WILLIAM, VESTAL, N.Y. 13 850, US, BARD, STEVEN LYNDZ, ENDWELL, N.Y. 13 760, US
Format:	Patent
Sprache:	ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY GENERAL PROCESSES OF COMPOUNDING HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	Polyimide is etched by contacting the polyimide with an aqueous solution of a metal hydroxide followed by contact with an acid followed by contact with an aqueous solution of a metal hydroxide. Etching of chemically cured polyimide can be enhanced by employing a presoaking in hot water. Also, partially etched chemically cured polyimide is removed with a concentrated acid solution. In preparing a metal coated polyimide structure for subsequent gold plating, two flash etching steps with the polyimide etch between are employed after developing the photoresist.