Verfahren zur Ablagerung eines dünnen Oxydfilms

A substrate (11) to be deposited an oxide thin film thereon is set a reactor (10). An organic metal source gas and oxygen-containing gas are introduced into the reactor to pyrolyze, thereby depositing an oxide thin film containing metal elements of the organic metal at which time an inert gas is use...

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Bibliographische Detailangaben
Hauptverfasser:	NAKANISI, TAKATOSI, SATOH, RIE, EGUCHI, KAZUHIRO
Format:	Patent
Sprache:	ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A substrate (11) to be deposited an oxide thin film thereon is set a reactor (10). An organic metal source gas and oxygen-containing gas are introduced into the reactor to pyrolyze, thereby depositing an oxide thin film containing metal elements of the organic metal at which time an inert gas is used as a carrier gas for the carrier gas. In the deposition of a thin film, the organic metal source gas and oxygen-containing gas are alternately fed into the reactor (10).