STRATE

A plasma reactor for PECVD treatment of large-size substrates according to the invention comprises a vacuum process chamber as an outer chamber and at least one inner reactor with an electrode show-erhead acting as RF antenna, said inner reactor again comprising a reactor bottom and a reactor top, w...

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Bibliographische Detailangaben
Hauptverfasser:	ELYAAKOUBI, MUSTAPHA, DELAUNAY, LAURENT, AING, PHANNARA, JOST, STEPHAN
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A plasma reactor for PECVD treatment of large-size substrates according to the invention comprises a vacuum process chamber as an outer chamber and at least one inner reactor with an electrode show-erhead acting as RF antenna, said inner reactor again comprising a reactor bottom and a reactor top, whereby stiffeners are supporting the reactor top and/or the reactor bottom, said stiffeners being connected to reactor top (2) and/or reactor bottom (6) via compensation spacers (4) with thicknesses chosen to compensate the thermal expansion during operation.