Metallschablone und Verfahren zum Drucken von bleifreier Lötpaste mit derselben

A lead-free solder paste printing method is practiced with use of a metal mask having two openings which are circular or elliptical in shape by placing the metal mask (1) on a circuit board (2) having an electrode (21) formed in a predetermined pattern to join an end portion of a lead member (6), an...

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Bibliographische Detailangaben
Hauptverfasser:	KOMAMIZU, SHUICHI, MAKINO, KAZUMI, MORI, TAKAYUKI
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE PERFORMING OPERATIONS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTED CIRCUITS PRINTING PRINTING PLATES OR FOILS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A lead-free solder paste printing method is practiced with use of a metal mask having two openings which are circular or elliptical in shape by placing the metal mask (1) on a circuit board (2) having an electrode (21) formed in a predetermined pattern to join an end portion of a lead member (6), and moving a printing squeegee along the upper surface of the metal mask (1) to thereby print a lead-free solder paste on the surface of the electrode (21) on the circuit board (2). The method produces on the electrode (21) of the circuit board (2) two lead-free solder paste patterns (30a,30a) each circular or elliptical in shape and arranged in a direction in which the lead member (6) is to extend from the electrode.