VEBINDUNGSANORDNUNG FÜR EINE RÜCKWANDVERDRAHTUNG EINER ELEKTRONISCHEN ANLAGE

This interconnection module for the base of an electronic device casing carries out the transfer, at the faces of the printed circuit boards ( 4, 5 ) supporting the components of the device housed in the casing, of a field of connection points with the external environment of the casing embodied by the rear ends of the pins of a semi-connector fixed to the back of the casing while still retaining the compactness of the casing despite a very large number of connection points with the external environment of the casing (several hundreds of them). This module takes the form of a three-panel structure with a central panel 7 fixed to the rear ends of the pins of the semi-connector ( 3 ) mounted on the back of the casing and two side panels ( 8, 9 ) folded and placed flat against each other, joined to the longitudinal edges of the central panel ( 7 ) by flexible printed circuit elements ( 10, 11 ) and supporting the field of connection points transferred to the level of the faces of the boards ( 4,5 ) of the electronic device. Electronic connections link the two fields of connection points in going through the joining parts ( 10, 11 ).