Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren

Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren

The substrate holder (20) comprises a movable plate (23) elastically mounted inside a main body (22). With the substrate holder (20) the polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate (23). In a first (down...

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Hauptverfasser: HOLLATZ, MARK, LAHNOR, PETER
Format: Patent
Sprache:ger
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BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator HOLLATZ, MARK
LAHNOR, PETER
description The substrate holder (20) comprises a movable plate (23) elastically mounted inside a main body (22). With the substrate holder (20) the polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate (23). In a first (downward) mode the movable plate (23) stays in mechanical contact with the substrate (12) whereas in a second (upward) mode an air cushion is generated in a chamber (29) between the movable plate (23) and the substrate (12) for pressurizing the substrate (12) onto the polishing pad.
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subjects BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
title Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren
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