Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren

The substrate holder (20) comprises a movable plate (23) elastically mounted inside a main body (22). With the substrate holder (20) the polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate (23). In a first (down...

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Bibliographische Detailangaben
Hauptverfasser:	HOLLATZ, MARK, LAHNOR, PETER
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The substrate holder (20) comprises a movable plate (23) elastically mounted inside a main body (22). With the substrate holder (20) the polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate (23). In a first (downward) mode the movable plate (23) stays in mechanical contact with the substrate (12) whereas in a second (upward) mode an air cushion is generated in a chamber (29) between the movable plate (23) and the substrate (12) for pressurizing the substrate (12) onto the polishing pad.