Beschichtungszusammensetzung für die Filmherstellung und Material für isolierenden Schichten

A composition for film formation which is useful as an interlayer insulating film material in the production of semiconductor devices and the like, and gives a coating film having excellent uniformity, low dielectric constant, low leakage current and excellent storage stability; and a material for i...

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Bibliographische Detailangaben
Hauptverfasser: NISHIKAWA, MICHINORI, KAKUTA, MAYUMI, YAMADA, KINJI, INOUE, YASUTAKE, HAKAMATSUKA, SATOKO, TAMAKI, KENTAROU, EBISAWA, MASAHIKO
Format: Patent
Sprache:ger
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Zusammenfassung:A composition for film formation which is useful as an interlayer insulating film material in the production of semiconductor devices and the like, and gives a coating film having excellent uniformity, low dielectric constant, low leakage current and excellent storage stability; and a material for insulating film formation using the composition. The composition comprises (A) a product of hydrolysis and condensation obtained by hydrolyzing and condensing at least one compound selected from the group consisting of (A-1) compounds represented by the formula (1): R aSi(OR )4-a, and (A-2) compounds represented by the formula (2): R b(R O)3-bSi-(R )d-Si(OR )3-cR c; and (B) a compound represented by the formula (3): R O(CHCH3CH2O)eR .