Klebeverfahren und elektronisches Bauteil

The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to a fixed direction u...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMATO, MASAHUMI, TATEDA, SHINYA, TOBITA, MASAYUKI, KIMURA, TSUNEHISA
Format:	Patent
Sprache:	ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS THEREOF DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL NON-METALLIC ELEMENTS PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to a fixed direction under the magnetic atmosphere. The invention also provides an electronic component for effectively dissipating heat generated from a semiconductor device (2), power source (4), light source or other components used for electric products, and an electronic component having excellent radiation.