Electroplating bath and process for white palladium

Electroplating bath and process for white palladium

The present invention relates to an improved metal-containing additive-free palladium electroplating bath which comprises the use of a sulphonic acid compound in combination with a special class of pyridine-related nitrogen compounds in order to both stabilise the bath and to provide white palladium...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TOO, ELENA, BRANFORD, CONN., US, PANECCASIO JUN., VINCENT, MADISON, CONN., US
Format: Patent
Sprache:eng ; ger
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
HETEROCYCLIC COMPOUNDS
METALLURGY
ORGANIC CHEMISTRY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TOO, ELENA, BRANFORD, CONN., US
PANECCASIO JUN., VINCENT, MADISON, CONN., US
description The present invention relates to an improved metal-containing additive-free palladium electroplating bath which comprises the use of a sulphonic acid compound in combination with a special class of pyridine-related nitrogen compounds in order to both stabilise the bath and to provide white palladium deposits over an extended range of plating thicknesses.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DE4428966A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DE4428966A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DE4428966A13</originalsourceid><addsrcrecordid>eNrjZDB2zUlNLinKL8hJLMnMS1dISizJUEjMS1EoKMpPTi0uVkjLL1Ioz8gsSVUoSMzJSUzJLM3lYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxLq4mJkYWlmZmjobGRCgBALbVLCc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electroplating bath and process for white palladium</title><source>esp@cenet</source><creator>TOO, ELENA, BRANFORD, CONN., US ; PANECCASIO JUN., VINCENT, MADISON, CONN., US</creator><creatorcontrib>TOO, ELENA, BRANFORD, CONN., US ; PANECCASIO JUN., VINCENT, MADISON, CONN., US</creatorcontrib><description>The present invention relates to an improved metal-containing additive-free palladium electroplating bath which comprises the use of a sulphonic acid compound in combination with a special class of pyridine-related nitrogen compounds in order to both stabilise the bath and to provide white palladium deposits over an extended range of plating thicknesses.</description><edition>6</edition><language>eng ; ger</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; HETEROCYCLIC COMPOUNDS ; METALLURGY ; ORGANIC CHEMISTRY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19950223&amp;DB=EPODOC&amp;CC=DE&amp;NR=4428966A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19950223&amp;DB=EPODOC&amp;CC=DE&amp;NR=4428966A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOO, ELENA, BRANFORD, CONN., US</creatorcontrib><creatorcontrib>PANECCASIO JUN., VINCENT, MADISON, CONN., US</creatorcontrib><title>Electroplating bath and process for white palladium</title><description>The present invention relates to an improved metal-containing additive-free palladium electroplating bath which comprises the use of a sulphonic acid compound in combination with a special class of pyridine-related nitrogen compounds in order to both stabilise the bath and to provide white palladium deposits over an extended range of plating thicknesses.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>HETEROCYCLIC COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB2zUlNLinKL8hJLMnMS1dISizJUEjMS1EoKMpPTi0uVkjLL1Ioz8gsSVUoSMzJSUzJLM3lYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxLq4mJkYWlmZmjobGRCgBALbVLCc</recordid><startdate>19950223</startdate><enddate>19950223</enddate><creator>TOO, ELENA, BRANFORD, CONN., US</creator><creator>PANECCASIO JUN., VINCENT, MADISON, CONN., US</creator><scope>EVB</scope></search><sort><creationdate>19950223</creationdate><title>Electroplating bath and process for white palladium</title><author>TOO, ELENA, BRANFORD, CONN., US ; PANECCASIO JUN., VINCENT, MADISON, CONN., US</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE4428966A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>1995</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>HETEROCYCLIC COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>TOO, ELENA, BRANFORD, CONN., US</creatorcontrib><creatorcontrib>PANECCASIO JUN., VINCENT, MADISON, CONN., US</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOO, ELENA, BRANFORD, CONN., US</au><au>PANECCASIO JUN., VINCENT, MADISON, CONN., US</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electroplating bath and process for white palladium</title><date>1995-02-23</date><risdate>1995</risdate><abstract>The present invention relates to an improved metal-containing additive-free palladium electroplating bath which comprises the use of a sulphonic acid compound in combination with a special class of pyridine-related nitrogen compounds in order to both stabilise the bath and to provide white palladium deposits over an extended range of plating thicknesses.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; ger
recordid cdi_epo_espacenet_DE4428966A1
source esp@cenet
subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
HETEROCYCLIC COMPOUNDS
METALLURGY
ORGANIC CHEMISTRY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Electroplating bath and process for white palladium
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-30T22%3A58%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TOO,%20ELENA,%20BRANFORD,%20CONN.,%20US&rft.date=1995-02-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EDE4428966A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true