Electroplating bath and process for white palladium

The present invention relates to an improved metal-containing additive-free palladium electroplating bath which comprises the use of a sulphonic acid compound in combination with a special class of pyridine-related nitrogen compounds in order to both stabilise the bath and to provide white palladium...

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Bibliographische Detailangaben
Hauptverfasser:	TOO, ELENA, BRANFORD, CONN., US, PANECCASIO JUN., VINCENT, MADISON, CONN., US
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HETEROCYCLIC COMPOUNDS METALLURGY ORGANIC CHEMISTRY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The present invention relates to an improved metal-containing additive-free palladium electroplating bath which comprises the use of a sulphonic acid compound in combination with a special class of pyridine-related nitrogen compounds in order to both stabilise the bath and to provide white palladium deposits over an extended range of plating thicknesses.