Gerät zum Schneiden von Verdrahtungen bzw. Leiterbahnen

An apparatus (2) for cutting a wiring on a printed wiring board (1) using a laser beam has a laser oscillator (34) for emitting a laser beam along a main optical path, a multiaxis positioning means for changing the three-dimensional coordinates of a printing wiring board, an X-Y adjustment means (18...

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Bibliographische Detailangaben
Hauptverfasser:	KOIDE, MASATERU, KAWASAKI, KANAGAWA, JP, IKEDA, HIROSHI, KAWASAKI, KANAGAWA, JP
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus (2) for cutting a wiring on a printed wiring board (1) using a laser beam has a laser oscillator (34) for emitting a laser beam along a main optical path, a multiaxis positioning means for changing the three-dimensional coordinates of a printing wiring board, an X-Y adjustment means (18) for adjusting two-dimensional coordinates, perpendicular to the main optical path, a means for optically measuring form parameters of a wiring to be cut, and a control means for controlling beam parameters of the laser beam in accordance with the measured form parameters.