Apparat und Verfahren für das berührungslose Messen der Diameter, der Stumpfheit und der Position der Spritze eines Bohrers

A laser based, noncontacting measurement instrument particularly adapted for the printed circuit board drilling industry is disclosed. The instrument accurately measures drill diameter, runout, and tip position under actual operating conditions. A laser beam is focused in space and the amount of lig...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JALKIO, JEFFREY A., ST. PAUL, MINNESOTA 55105, US, CASE, STEVEN K., ST. LOUIS PARK, MINNESOTA 55416, US, SKUNES, TIMOTHY A., COLUMBIA HEIGHTS, MINNESOTA 55421, US
Format: Patent
Sprache:ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A laser based, noncontacting measurement instrument particularly adapted for the printed circuit board drilling industry is disclosed. The instrument accurately measures drill diameter, runout, and tip position under actual operating conditions. A laser beam is focused in space and the amount of light occluded by the drill bit as the bit is passed through the beam is sensed by a detector. Diameter, runout, and tip position are calculated by measuring the amount of occlusion, monitoring the angular orientation of the rotating drill; and correlating the amount of light occlusion to the angular orientation of the drill. The instrument automatically compensates for dust and debris in the optical path.