Anordnung zum Erwärmen einer Bondstelle beim Goldraht-Thermosonic-Wirebonden

Arrangement for heating a bonding point (4) in the case of gold-wire thermosonic wire bonds by means of a laser beam (7) which comes from a laser and is guided by way of a waveguide (6), characterised by a standard bonding device (1) having a conventional capillary tube (3), by a focusing lens (5) w...

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Bibliographische Detailangaben
Hauptverfasser:	HAGEN, ROBERT., 93092 BARBING, DE, BINNER, RALPH., 01109 DRESDEN, DE
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Arrangement for heating a bonding point (4) in the case of gold-wire thermosonic wire bonds by means of a laser beam (7) which comes from a laser and is guided by way of a waveguide (6), characterised by a standard bonding device (1) having a conventional capillary tube (3), by a focusing lens (5) which is arranged on the bonding head (2) of the bonding device (1), and by a highly flexible waveguide (6) which is connected to the laser and the focusing lens (5).