Monolithic multilayer chip inductor and method for its production

A monolithic multilayer chip inductor has a multiplicity of assemblies (20, 30, 44, 58) which are stacked one on top of the other. Each assembly has a ferrite layer (22, 32, 46, 60), on the top surface of which is printed a coil conductor (24, 36, 50, 64). Except for the bottom layer (22) and a top ferrite cap (70), all the ferrite layers have through-holes (34, 48, 62), which allow an electrical connection between the conductor coils on one layer to the next. One end (68) of the upper coil conductor (64) projects at the edge (16) of the chip (10), and one end (26) of the lower coil conductor (24) projects at another edge (14) of the chip (10), with the result that the conductors can be connected to connections in order that an electric current can be introduced which passes through all of the coils connected one beneath the other.