Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung

The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsically electrical conductivity is adhesively deposited on nonconductive areas of the printed circuit boards, whereupon a metal film is app...

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Bibliographische Detailangaben
Hauptverfasser:	ROESCH, GERHARD, 90461 NUERNBERG, DE, STUCKMANN, WALTER, 90518 ALTDORF, DE
Format:	Patent
Sprache:	ger
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsically electrical conductivity is adhesively deposited on nonconductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pretreatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidative pretreatment.