Semiconductor device formed on module substrate - has resin moulded package with conductors providing respective internal connections at one end and external connections at other

The semiconductor device includes a semiconductor element (5) with a rectangular main surface and a number of electrodes (9) parallel to one side of the surface. An insulator (8) is placed between the main surface an a number of conductors (3A) corresponding to the electrodes. The conductors are arranged so as not to cross each other. Each conductor has one end (3) which provides the internal connection near to the corresponding electrode and electrically connected to it. The other end (4) is arranged on one of the short sides of the main surface and provides the external connection. The semiconductor element, the electrodes and the conductors, but not the external connections, are moulded in resin (1). ADVANTAGE - Can be mfd. with very high density for reduced external dimensions of package. Shortened line connections on substrate for high speed operation.