Semiconductor wafer structure forming peripheral structure of semiconductor device chip - has insulating layer on surface of substrate with mutually insulated openings which respectively surround device areas on substrate

A semiconductor wafer structure includes a semiconductor substrate (2) with a number of semiconductor device areas (60) and a number of cutting line areas (50) which separate the device areas from each other. An insulating layer (7) of a first material is formed on a surface of the substrate. The isolation layer contains a number of openings (51) which each surround a respective device area, and which are electrically isolated from each other. The openings are filled with a layer of a second material which is enclosed within each opening. ADVANTAGE - Extends life of substrate cutting blade. Prevents short circuits between bonding-pads due to cutting wafer into chips, and improves reliability.