Hybrid semiconductor structure mfg. system - with semiconductor chips incorporating semiconductor components attached to semiconductor carrier substrate

The mfg. system uses a semiconductor carrier substrate (11) in which semiconductor elements and structures (12) are formed and a second semiconductor substrate (21) of a different semiconductor material which is provided with epitaxial layers (22) and divided into chips (20) of required size. Each o...

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Bibliographische Detailangaben

Hauptverfasser:	WARTH, MARTIN-MIN., 7052 SCHWAIKHEIM, SCHMITT, REINHOLD.NAT., 7152 ASPACH, HIRCHE, KLAUS., 7000 STUTTGART
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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