Hybrid semiconductor structure mfg. system - with semiconductor chips incorporating semiconductor components attached to semiconductor carrier substrate

The mfg. system uses a semiconductor carrier substrate (11) in which semiconductor elements and structures (12) are formed and a second semiconductor substrate (21) of a different semiconductor material which is provided with epitaxial layers (22) and divided into chips (20) of required size. Each of these chips is attached to the carrier substrate, with connections provided between semiconductor components incorporated in the attached chips and the carrier substrate structures. The surface of the carrier substrate may be provided with recesses, in which the attached chips are located. ADVANTAGE - Reduces material costs of non-silicon semiconductor substrate.