Silicon@ injection plate mfr. - has both sides of bottom plate etched simultaneously with the use of etching masks

Manufacture of silicon injection plates which are formed by bonding a top plate (1) having at least one injection hole (3) with a bottom silicon plate (2) having at least one through hole (4). The injection hole (3) and the through hole (4) are located one above another. Furthermore, channels (5) be...

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Bibliographische Detailangaben
Hauptverfasser:	JAUERNIG, UDO., 7410 REUTLINGEN, DE, FINDLER, GUENTHER., 7000 STUTTGART, DE, BOEHRINGER, ALEXANDRA, 7257 DITZINGEN, DE, MUENZEL, HORST. DR., 7410 REUTLINGEN, DE, BUCHHOLZ, JUERGEN. , 7128 LAUFFEN, DE
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BLASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMBUSTION ENGINES DIFFUSION TREATMENT OF METALLIC MATERIAL HEATING HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MECHANICAL ENGINEERING METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE NOZZLES PERFORMING OPERATIONS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL SUPPLYING COMBUSTION ENGINES IN GENERAL, WITH COMBUSTIBLEMIXTURES OR CONSTITUENTS THEREOF TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	Manufacture of silicon injection plates which are formed by bonding a top plate (1) having at least one injection hole (3) with a bottom silicon plate (2) having at least one through hole (4). The injection hole (3) and the through hole (4) are located one above another. Furthermore, channels (5) between the through hole (4) and the outer edge (6) of the silicon injection plate are formed by means of take-outs in the plates (1,2). The method is characterised by the fact that the bottom plate (2) is shaped by simultaneous two-sided anisotropic etching of silicon. Etching of the plate (2) is carried out with the use of etching masks on both sides of the plate. The process is continued until the etchant has penetrated through half the plate thickness. ADVANTAGE - The process is simplified, with the number of operations reduced. The silicon plates can be mfd. with esp. low mfg. tolerances.