GERAET ZUM HERSTELLEN VON ELEKTRODEN FUER ELEKTRONISCHE BAUELEMENTE DES CHIP-TYPES

A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KASHIWAGI, NOBUAKI, KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP, NAKAGAWA, TADAHIRO, OMURO, SATOSHI, YOSHIDA, KIYOSHI, TAZUKE, SHIZUMA
Format: Patent
Sprache:ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KASHIWAGI, NOBUAKI
KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP
NAKAGAWA, TADAHIRO
OMURO, SATOSHI
YOSHIDA, KIYOSHI
TAZUKE, SHIZUMA
description A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360 DEG for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DE4206989A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DE4206989A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DE4206989A13</originalsourceid><addsrcrecordid>eNrjZAhydw1ydA1RiAr1VfBwDQoOcfXxcfVTCPP3U3D1cfUOCfJ3AXLdQl2DYHw_z2BnD1cFJ8dQoICvq1-Iq4KLa7CCs4dngG5IZIBrMA8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXdxNTEyMLO0sHQ0NCZCCQCSIC9q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GERAET ZUM HERSTELLEN VON ELEKTRODEN FUER ELEKTRONISCHE BAUELEMENTE DES CHIP-TYPES</title><source>esp@cenet</source><creator>KASHIWAGI, NOBUAKI ; KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP ; NAKAGAWA, TADAHIRO ; OMURO, SATOSHI ; YOSHIDA, KIYOSHI ; TAZUKE, SHIZUMA</creator><creatorcontrib>KASHIWAGI, NOBUAKI ; KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP ; NAKAGAWA, TADAHIRO ; OMURO, SATOSHI ; YOSHIDA, KIYOSHI ; TAZUKE, SHIZUMA</creatorcontrib><description>A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360 DEG for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.</description><language>ger</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RESISTORS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930513&amp;DB=EPODOC&amp;CC=DE&amp;NR=4206989A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930513&amp;DB=EPODOC&amp;CC=DE&amp;NR=4206989A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KASHIWAGI, NOBUAKI</creatorcontrib><creatorcontrib>KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP</creatorcontrib><creatorcontrib>NAKAGAWA, TADAHIRO</creatorcontrib><creatorcontrib>OMURO, SATOSHI</creatorcontrib><creatorcontrib>YOSHIDA, KIYOSHI</creatorcontrib><creatorcontrib>TAZUKE, SHIZUMA</creatorcontrib><title>GERAET ZUM HERSTELLEN VON ELEKTRODEN FUER ELEKTRONISCHE BAUELEMENTE DES CHIP-TYPES</title><description>A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360 DEG for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>RESISTORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhydw1ydA1RiAr1VfBwDQoOcfXxcfVTCPP3U3D1cfUOCfJ3AXLdQl2DYHw_z2BnD1cFJ8dQoICvq1-Iq4KLa7CCs4dngG5IZIBrMA8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXdxNTEyMLO0sHQ0NCZCCQCSIC9q</recordid><startdate>19930513</startdate><enddate>19930513</enddate><creator>KASHIWAGI, NOBUAKI</creator><creator>KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP</creator><creator>NAKAGAWA, TADAHIRO</creator><creator>OMURO, SATOSHI</creator><creator>YOSHIDA, KIYOSHI</creator><creator>TAZUKE, SHIZUMA</creator><scope>EVB</scope></search><sort><creationdate>19930513</creationdate><title>GERAET ZUM HERSTELLEN VON ELEKTRODEN FUER ELEKTRONISCHE BAUELEMENTE DES CHIP-TYPES</title><author>KASHIWAGI, NOBUAKI ; KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP ; NAKAGAWA, TADAHIRO ; OMURO, SATOSHI ; YOSHIDA, KIYOSHI ; TAZUKE, SHIZUMA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE4206989A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>ger</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>RESISTORS</topic><toplevel>online_resources</toplevel><creatorcontrib>KASHIWAGI, NOBUAKI</creatorcontrib><creatorcontrib>KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP</creatorcontrib><creatorcontrib>NAKAGAWA, TADAHIRO</creatorcontrib><creatorcontrib>OMURO, SATOSHI</creatorcontrib><creatorcontrib>YOSHIDA, KIYOSHI</creatorcontrib><creatorcontrib>TAZUKE, SHIZUMA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KASHIWAGI, NOBUAKI</au><au>KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP</au><au>NAKAGAWA, TADAHIRO</au><au>OMURO, SATOSHI</au><au>YOSHIDA, KIYOSHI</au><au>TAZUKE, SHIZUMA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GERAET ZUM HERSTELLEN VON ELEKTRODEN FUER ELEKTRONISCHE BAUELEMENTE DES CHIP-TYPES</title><date>1993-05-13</date><risdate>1993</risdate><abstract>A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360 DEG for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language ger
recordid cdi_epo_espacenet_DE4206989A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESISTORS
title GERAET ZUM HERSTELLEN VON ELEKTRODEN FUER ELEKTRONISCHE BAUELEMENTE DES CHIP-TYPES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T15%3A26%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KASHIWAGI,%20NOBUAKI&rft.date=1993-05-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EDE4206989A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true