GERAET ZUM HERSTELLEN VON ELEKTRODEN FUER ELEKTRONISCHE BAUELEMENTE DES CHIP-TYPES

A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding...

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Bibliographische Detailangaben
Hauptverfasser:	KASHIWAGI, NOBUAKI, KIMOTO, TAKASHI, NAGAOKAKYO, KYOTO, JP, NAKAGAWA, TADAHIRO, OMURO, SATOSHI, YOSHIDA, KIYOSHI, TAZUKE, SHIZUMA
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS
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Beschreibung
Zusammenfassung:	A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360 DEG for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.