Metal-contg. moulding materials with high thermal conductivity - contain thermotropic polymer, metal filler and phenol], calixarene, polyvinyl-phenol, poly:arylene phosphonate or hydrolysable organo-silane

Moulding materials (I) are claimed contg. (A) 15-70 wt. % thermotropic polymer, (B) 30-85 wt. % metallic filler and (C) 0.1-10 wt. % cpd. of formula (IIA) (with Mn below 10,000) (IIB), (IIC), (IIC), (IIE) or CH3(CH2)qSiX3 (IIF) R1, R2 = H, 1-22C alkyl or 6-14C aryl; R3 = H, 1-22C alkyl, 6-14C aryl, OH or corresponds to a bracing gp. in residue (A) n = 0-100; R4, R5 = H, 1-22C alkyl or 6-14C aryl (one gp. = H and the other is different from H); R6, R7. 1-22C alkyl or 6-14C aryl (at least one gp. = H); R8 = H, 1-22C alkyl or 6-14C aryl; R9 = H or Me, pref. H; m = 10-500; p = 1-100; X = OMe, OEt, or Cl; q = 0-17. Pref. component (A) has repeating units derived from (a) aromatic hydroxyacids (40-85 mol. %) (b) aromatic amino acids (0-40 mol. %), (c) diphenols (60-15 mol. %) (d) amino-phenols (0-25 mol. %), (e) aromatic dicarboxylic acids and opt. (f) carbonic acid or derivs. thereof. (B) is Al or an alloy of Al with Si, Cu, Mg, Li, and Ti, or Mg or a Mg/Al alloy, pref. Al alone. USE/ADVANTAGE - (I) are moulding materials which can be processed without expensive sintering procedures to give prods. with thermal conductivity higher than that of prior-art materials with the same amt. of metal. The prods. include heat exchangers, casings etc.