VORRICHTUNG ZUM BEHANDELN VON PLATTENFOERMIGEN GEGENSTAENDEN, INSBESONDERE LEITERPLATTEN

In the case of treatment of printed-circuit boards with fluids, especially during cleaning, etching, metallisation and flushing, in order to achieve treatment which is effective and can be dimensioned precisely in time, the region which is coated by means of a spray nozzle, surge nozzle or a standin...

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Bibliographische Detailangaben
1. Verfasser:	SCHMID, CHRISTIAN, 7290 FREUDENSTADT, DE
Format:	Patent
Sprache:	ger
Schlagworte:	APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE NOZZLES PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	In the case of treatment of printed-circuit boards with fluids, especially during cleaning, etching, metallisation and flushing, in order to achieve treatment which is effective and can be dimensioned precisely in time, the region which is coated by means of a spray nozzle, surge nozzle or a standing wave is bounded by suction devices (24, 25, 41, 42). Said suction devices are provided in front of and behind the application device (28, 38). The spray nozzles and surge nozzles (22, 24, 25) are arranged in a common housing past whose lower periphery the boards (12) to be treated pass horizontally.