Heating and cooling arrangement

The arrangment comprises a structure suspended from a ceiling. A fluid flows in a pipe or tube system both a thermal coupling between the fluid and a carrier consisting of a material which is a good thermal conductor. A sweet water drip collector is disposed below the carrier. A heat resistance (23,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KOESTER, HELMUT., 6000 FRANKFURT, DE
Format: Patent
Sprache:eng ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The arrangment comprises a structure suspended from a ceiling. A fluid flows in a pipe or tube system both a thermal coupling between the fluid and a carrier consisting of a material which is a good thermal conductor. A sweet water drip collector is disposed below the carrier. A heat resistance (23, 42, 43,) with a given heat insulation value is connected with at least one surface of the sweat water drip collector (32, 36) so that at least the underside of the sweat water drip collector (32, 46) does not go below the dew point.