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Method of seeding a substrate surface to be metallised, especially by electroless plating, in which the surface is coated with a layer of a substance, such as palladium acetate, which can furnish seeds or nucleation sites for a chemical deposition of metal, such as copper, and which substance is dec...

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Bibliographische Detailangaben
Hauptverfasser:	ZHANG, YANPING, STUKE, MICHAEL. DR, GOTTSLEBEN, OLIVER. DR., 3400 GOETTINGEN, DE
Format:	Patent
Sprache:	ger
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	Method of seeding a substrate surface to be metallised, especially by electroless plating, in which the surface is coated with a layer of a substance, such as palladium acetate, which can furnish seeds or nucleation sites for a chemical deposition of metal, such as copper, and which substance is decomposed by synchrotron radiation of an intensity which effects a substantially photolytic but not thermal decomposition of the substance.