Bonding shoe parts, esp. for shoe repair - by applying solvent-free polyurethane dispersion adhesive and drying in microwave oven before bringing parts together

Process for bonding parts of shoes, partic. the bottom parts, esp. for shoe repair, is carried out by applying a polyurethane dispersion adhesive (I) to the parts and drying the adhesive with a microwave heater before bringing the parts together. Pref, (I) is a PU dispersion contg. little or no solv...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BUCHHOLZ, GEB. PINTEN, ANNELIESE, BUCHHOLZ, HEINZ., 5000 KOELN, DE
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FOOTWEAR HUMAN NECESSITIES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MACHINES, TOOLS, EQUIPMENT OR METHODS FOR MANUFACTURING ORREPAIRING FOOTWEAR MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Process for bonding parts of shoes, partic. the bottom parts, esp. for shoe repair, is carried out by applying a polyurethane dispersion adhesive (I) to the parts and drying the adhesive with a microwave heater before bringing the parts together. Pref, (I) is a PU dispersion contg. little or no solvent, mixed with a thickener and a resin dispersion (pref. together with an emulsifier), a wetting agent and a foam suppressant. Device for carrying out the above process consists of a micro-wave appts (I) which can be closed, with several (pref. at least 4) power levels, and a carrier (2) for the shoe (see Fig. 1). (I) is pref simultaneously dried and activated so that, when the water is completely driven off, the PU particles soften and flow together to form a sealed layer of adhesive; (I) contains no crosslinker, or a crosslinker, pref. a water-emulsifiable polyisocyanate, is added immediately before use; (I) is a PU dispersion adhesive contg. a thickener, which is readily applied by brushing; standard mixt. ADVANTAGE: The invention provides an economical process for bonding shoe parts(for repair and mfr) with solvent-free dispersion adhesives.