Electronic chip module - with contacting provided by thickened chip connection regions opposite reed contacts

(A) An electronic module, used esp. in a chip card, has a semiconductor element fixed on a carrier including a plastic foil which has openings and a metallisation divided into read contacts, connection regions on one of the semiconductor element faces being contacted with the read contacts via the openings. The novelty is that the element (1) is fixed onto the side of the foil (2) opposite the read contact (3) side and its connection regions are thickened by bumps (8) which project into the openings (6). (B) Processes for prodn. of the module are also claimed. Contact between each bump (8) and the associated read contact (3) may be produced by a solder bridge (9) of Sn, Sn/Pb or In/Pb formed by a fusible solder paste. Alternatively, contact may be produced by electrolytically thickening the read contacts (3) with In (alloy) by directly contacting the bumps (8) with the read contacts (3) or by electrolytically thickening the bumps (8). ADVANTAGE - The module is mechanically robust, is readily produced in flat form and is inexpensive.