Bindung reiner Metallfilme an Keramik

The bonding of nickel, cobalt, copper or any number of metals to oxide ceramics is achieved whereby the substrate and associated metallurgy are co-sintered. The invention teaches the use of an intermediary oxide such as Al2O3, Cr2O3, TiO2 or ZrO2 which will adhere to the substrate and in the presenc...

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Bibliographische Detailangaben
Hauptverfasser: MASTER, RAJ NAVINCHANDRA, WAPPINGERS FALLS NEW YORK, US, FLAITZ, PHILIP LEE, POUGHKEEPSIE NEW YORK, US, REDDY, SRINIVASA S.N., LAGRANGEVILLE NEW YORK, US, PALMATEER, PAUL HARRY, WAPPINGERS FALLS NEW YORK, US
Format: Patent
Sprache:ger
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Zusammenfassung:The bonding of nickel, cobalt, copper or any number of metals to oxide ceramics is achieved whereby the substrate and associated metallurgy are co-sintered. The invention teaches the use of an intermediary oxide such as Al2O3, Cr2O3, TiO2 or ZrO2 which will adhere to the substrate and in the presence of firing ambients, form a complex ternary oxide with the overlying metal thereby creating the desired bond. The eutectic can be created during the firing cycle without the undesired consequence of oxidizing the metal. The so-called intermediary oxides can be oxidized in situ, deposited as oxides, or introduced into either the ceramic composition or the metal paste.