HALBLEITER-BAUELEMENT

HALBLEITER-BAUELEMENT

A material which is rubber-like at room temperature and has excellent heat resistance and whose glass transition temperature is 0 DEG C. or below is used as a die bonding material for securing a semiconductor chip to a lead frame. Since the heat shrinkage of the lead frame is not directly transmitte...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: FUKUSHIMA, JIRO, ITAMI, HYOGO, JP
Format: Patent
Sprache:ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A material which is rubber-like at room temperature and has excellent heat resistance and whose glass transition temperature is 0 DEG C. or below is used as a die bonding material for securing a semiconductor chip to a lead frame. Since the heat shrinkage of the lead frame is not directly transmitted to the chip, it is possible to obtain a higly reliable semiconductor device which substantially overcomes the problem of chip warpage.