VERFAHREN ZUR HYDROPHILIERENDEN UND/ODER KITTRESTE ENTFERNENDEN OBERFLAECHENBEHANDLUNG VON SILICIUMSCHEIBEN

Silicon wafers can be provided with a hydrophilic surface and/or freed of adhering cement residues originating from the polishing operation with the aid of solutions adjusted to a pH of 8 to 14 with the aid of alkali-metal or alkaline-earth-metal compounds and containing hydrogen peroxide. These pro...

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Hauptverfasser: BAUER-MAYER,SUSANNE,DR, GRIESSHAMMER,RUDOLF,DR, BRUNNER,ROLAND, KIRSCHNER,HELMUT
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creator BAUER-MAYER,SUSANNE,DR
GRIESSHAMMER,RUDOLF,DR
BRUNNER,ROLAND
KIRSCHNER,HELMUT
description Silicon wafers can be provided with a hydrophilic surface and/or freed of adhering cement residues originating from the polishing operation with the aid of solutions adjusted to a pH of 8 to 14 with the aid of alkali-metal or alkaline-earth-metal compounds and containing hydrogen peroxide. These processes can even be carried out at room temperature and are remarkable for their low chemical consumption and easy manageability.
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subjects BASIC ELECTRIC ELEMENTS
CHEMISTRY
CLEANING
CLEANING IN GENERAL
COMPOUNDS THEREOF
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INORGANIC CHEMISTRY
METALLURGY
NON-METALLIC ELEMENTS
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title VERFAHREN ZUR HYDROPHILIERENDEN UND/ODER KITTRESTE ENTFERNENDEN OBERFLAECHENBEHANDLUNG VON SILICIUMSCHEIBEN
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