Plastic packaging for semiconductor components with spacing projections

In order to achieve a defined spacing between the semiconductor chip area and the semiconductor components mounted on the latter, protrusions built into the housing are arranged, according to the invention, on the lower packaging area of the semiconductor component.

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Bibliographische Detailangaben
1. Verfasser:	SCHULTZ,HELMUT
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In order to achieve a defined spacing between the semiconductor chip area and the semiconductor components mounted on the latter, protrusions built into the housing are arranged, according to the invention, on the lower packaging area of the semiconductor component.