Wiring support

The invention relates to a wiring support having metallic and non-metallic cores for the wiring of electronic components/assemblies, effective dissipation of heat losses, and having passive electrical functional elements and semiconductor components. The invention is based on the object of creating a wiring support which is in the form of a plate and has a large number of vertical through-connections for components which have a large number of terminals and use power intensively, which ensures the electrical power supply and heat dissipation using gaseous or liquid cooling media, and containing passive electrical functional elements as well as semiconductor components. According to the invention, the wiring support is produced by separating into wafers a strand through which there pass longitudinally and/or transversely metallic and non-metallic [lacuna], and contains (at defined points) through-connections, solid electrical bushings, electrical power supply leads, heat conducting dies, plug sockets, heat-dissipation profiles, passive electrical functional elements such as resistors, capacitors and the like, and semiconductor components, especially diodes and Peltier elements. Fields of application: computer and office technology, industrial robots and telecommunications, scientific equipment construction, consumer electronic items, measurement control and regulation technology, cycle II of circuit production, compact assemblies with optical outputs and inputs.