Method for improving the adhesive strength in micropack internal soldering, and application of the method
A method is proposed in which, during the soldering step, a gap is formed between connections of a film base and those of a semiconductor chip, which are to be soldered to one another. In this way, the adhesive strength of the soldered joints can be increased.
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| Format: | Patent |
| Sprache: | eng ; ger |
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| Zusammenfassung: | A method is proposed in which, during the soldering step, a gap is formed between connections of a film base and those of a semiconductor chip, which are to be soldered to one another. In this way, the adhesive strength of the soldered joints can be increased. |
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