Chip component, which can be dip-soldered, for use in boards

A chip component, which can be dip-soldered, for use in boards has an adhesive layer which is arranged on the underneath of the chip and has an adhesive which is contained in micro-capsules. The adhesive consists of a two-component adhesive whose two components are each contained in separate micro-c...

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Bibliographische Detailangaben
1. Verfasser:	BEHN,REINHARD
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A chip component, which can be dip-soldered, for use in boards has an adhesive layer which is arranged on the underneath of the chip and has an adhesive which is contained in micro-capsules. The adhesive consists of a two-component adhesive whose two components are each contained in separate micro-capsules.