Process for producing metallised conductor tracks and plated- through holes on perforated printed circuit boards

Process for producing metallised conductor tracks and plated- through holes on perforated printed circuit boards

The printed circuit boards (7) are introduced one after the other into a plurality of baths for preparing, carrying out and post- treating the metallisation and at least within the metallisation baths the flow is directed in such a way that the bath liquid concerned passes through the holes (9) of t...

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Bibliographische Detailangaben
Hauptverfasser: GRUHL, WINFRIED, HEPPNER, KLAUS-DIETER, 1000 BERLIN, DE
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Zusammenfassung:The printed circuit boards (7) are introduced one after the other into a plurality of baths for preparing, carrying out and post- treating the metallisation and at least within the metallisation baths the flow is directed in such a way that the bath liquid concerned passes through the holes (9) of the printed circuit boards (7) at a velocity adjusted to between 0.05 m/sec and 10 m/sec. The process is preferably used for the additive or semiadditive production of printed circuit boards and plated-through holes.