Electrical circuit arrangement having a printed-circuit board

An electrical circuit arrangement having a printed-circuit board is proposed, in which relatively large, copper-clad regions (12, 22) are used as cooling surfaces for heat dissipation on semiconductor components (13). For this purpose, the semiconductor component (13) to be cooled is arranged on a clad region (12) of the printed-circuit board (10), and a further clad region (22) on the opposite side of the printed-circuit board (10) is connected as a cooling surface via a plurality of through-plated holes (23) to the above-mentioned clad region (12). In this way, a relatively large amount of heat can be dissipated from the semiconductor components (13), with small printed-circuit board dimensions (Figure 1).