Epoxy/imide compositions

The invention relates to a composition which is suitable for the production of circuit boards and printed circuits and contains a product of the reaction of a) an epoxy resin or an epoxy novolak resin and optionally a brominated epoxy resin; and b) a bismaleimide; where the product of the reaction o...

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Bibliographische Detailangaben
1. Verfasser:	FRANK GRAHAM,WILLIAM
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to a composition which is suitable for the production of circuit boards and printed circuits and contains a product of the reaction of a) an epoxy resin or an epoxy novolak resin and optionally a brominated epoxy resin; and b) a bismaleimide; where the product of the reaction of a) and b) is subsequently reacted with a curing agent, such as a diamine of the formula H2N-R -NH2, where R is an aromatic, aliphatic or cycloaliphatic radical. This composition is used for impregnating a fibrous substrate made from glass fibres, high-temperature-resistant polyamides or graphite fibres, which is then laminated with a copper sheet. The resultant laminate is used for the production of printed circuits having good electrical and physical properties.