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A surface covering for wooden material e.g. chipboard has an at least two-ply laminar structure: a surface layer 1 of paper impregnated with 0 cross-linkable synthetic resin in a quantity of between 5 and 30% by weight as related to the weight of the original paper, and an overlay layer 3 to which t...

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Bibliographische Detailangaben
Hauptverfasser:	GAA,WERNER, OTTENSTROER,KLAUS, ROSSNAGEL,GREGOR, WEIDENMUELLER,JUERGEN,DR
Format:	Patent
Sprache:	ger
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	A surface covering for wooden material e.g. chipboard has an at least two-ply laminar structure: a surface layer 1 of paper impregnated with 0 cross-linkable synthetic resin in a quantity of between 5 and 30% by weight as related to the weight of the original paper, and an overlay layer 3 to which the surface layer is bonded by an adhesive layer 2 e.g. a polyacrylic acid ester, which overlay layer contains a preponderating proportion by weight of thermoplastic synthetic fibres, the materials being such that the weight per unit area of the surface layer and of the overlay layer is less than 70 g/m in each case. The overlay may be made by paper-making techniques and may comprise polyethylene and/or polypropylene fibres optionally admixed with cellulosic fibres.