DE2757821

The Mesa semiconductor device comprises an n-p-n-p structure with side walls protected by a silicon rubber layer. The anode is bonded to a carrier plate (80) which in turn is soldered to a terminal plate or clamping plate (84). This plate is attached to a piston. A flat metal plate is placed over th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKIGAMI, KATSUHIKO, YAMATO, KANAGAWA, JP, UTAGAWA, TADASHI, YOKOHAMA, JP, SAITO, YASUMASA, TSUJI, ISAMU, ITAZU, NOBUO, YOKOHAMA, KANAGAWA, JP, TSUKAKOSHI, TSUNEO, ZUSHI, KANAGAWA, JP
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!