Moulded casing protecting electronic components - has encasing sheet with thin corrugated walls inserted in heat sink

The mould is intended to protect electronic components mounted on a support. It consists of a board which is surrounded by flexible material, and the gap is filled with plastics. Thus, the surrounding material will be capable of adapting to different expansion coefficients of the plastics without an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ISSLER,JOERG, RITTNER,HANS, SOEHNER,GERHARD
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INSULATORS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The mould is intended to protect electronic components mounted on a support. It consists of a board which is surrounded by flexible material, and the gap is filled with plastics. Thus, the surrounding material will be capable of adapting to different expansion coefficients of the plastics without any joints. The encasing sheet (1) has a very thin wall and its surface can be corrugated. It will also be possible to insert the mould (3) in a heat sink (4). The plastics is anchored in position by elevations and cavities along the side. It has a relatively high mechanical strength and will dissipate any internal heat generated in the electronic circuit.