DE2539606

There is disclosed a thermosetting phenolic resin composition, suitable for use in injection molding, which resin composition contains a molding grade phenolic resin and an effective amount of a reactive compound (e.g., para-t-butylphenol) that is capable of reducing the viscosity of molding composi...

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Bibliographische Detailangaben
1. Verfasser:	SAUERS, MARVIN EDWARD, BELLE MEAD, N.J. (V.ST.A.)
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	There is disclosed a thermosetting phenolic resin composition, suitable for use in injection molding, which resin composition contains a molding grade phenolic resin and an effective amount of a reactive compound (e.g., para-t-butylphenol) that is capable of reducing the viscosity of molding compositions containing said phenolic resin composition to a processable viscosity at a temperature at which the period of time within which said molding composition cures to a thermoset state is longer than the period of time that said molding composition is in the runner during a normal injection molding operation. There is also disclosed molding compositions containing said phenolic resin composition, and an injection molding process utilizing the same.