Grid of piezoceramic chips on base - produced by bonding cutting in two directions and removing temporary cement

Grid of piezoceramic chips on base - produced by bonding cutting in two directions and removing temporary cement

Small squared chips of material are bonded at intervals into the form of a grid on to a base. A slice of the material is bonded to a mounting with a first adhesive which is resistant to liq. cleaners, cut into strips, and cleaned. The strips, bonded on one side to a mounting plate with a second adhe...

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Hauptverfasser: SASS,WOLFGANG, JOSCHKO,GUENTER
Format: Patent
Sprache:eng ; ger
Schlagworte:
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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creator SASS,WOLFGANG
JOSCHKO,GUENTER
description Small squared chips of material are bonded at intervals into the form of a grid on to a base. A slice of the material is bonded to a mounting with a first adhesive which is resistant to liq. cleaners, cut into strips, and cleaned. The strips, bonded on one side to a mounting plate with a second adhesive which is resistant to a sealant and to the first adhesive, are cut again similarly after sealing the first cuts. The final mountings are treated with solvent to remove the adhesive and sealant, the mounting plate being cut at the same time in one cutting operation. This is an economical method, which gives accurate layout of chips.
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subjects DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
title Grid of piezoceramic chips on base - produced by bonding cutting in two directions and removing temporary cement
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