Grid of piezoceramic chips on base - produced by bonding cutting in two directions and removing temporary cement

Small squared chips of material are bonded at intervals into the form of a grid on to a base. A slice of the material is bonded to a mounting with a first adhesive which is resistant to liq. cleaners, cut into strips, and cleaned. The strips, bonded on one side to a mounting plate with a second adhesive which is resistant to a sealant and to the first adhesive, are cut again similarly after sealing the first cuts. The final mountings are treated with solvent to remove the adhesive and sealant, the mounting plate being cut at the same time in one cutting operation. This is an economical method, which gives accurate layout of chips.