Vapour film deposition chamber - with conical plasma subchamber

Noble gas filled chamber for the deposition of films by cathode sputtering comprises a conical plasma chamber into which are set inverted funnel shaped cathode surfaces in the smaller upper opening of which is fitted the anode and the larger opening faces the deposition subchamber. The deposition su...

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Bibliographische Detailangaben
1. Verfasser:	WEISER,JOSEF
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Noble gas filled chamber for the deposition of films by cathode sputtering comprises a conical plasma chamber into which are set inverted funnel shaped cathode surfaces in the smaller upper opening of which is fitted the anode and the larger opening faces the deposition subchamber. The deposition subchamber contains a cathode plate on which the substrate are placed. The chamber permits the deposition of thick films.