Filling sub-mm cavities in circuit board coating with solder

The circuit board (6,6') is deeply immersed into the liquid solder (3) filling the cavities by compensation of surface tension by static pressure of the molten solder. The board is moved through a first solder filled transport duct (4) from top to bottom section (7) of the melt tub (2) by a dri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUSCHICK, JUERGEN, SZULZEWSKY, PAUL, BUTZKE, GUENTER, SCHIMKO, RICHARD, ROEMER, SIEGFRIED
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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