Thermosetting organopolysiloxanes for mounting electrical and electronic devices

Thermosetting organopolysiloxanes containing a platinum-containing inclusion compound as catalyst, and optionally polysaccharide derivatives are new. The thermosetting organopolysiloxanes contain: (A) organopolysiloxanes with an SiC bonded residue containing multiple aliphatic C-C residues; (B) orga...

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Bibliographische Detailangaben
Hauptverfasser:	HIERSTETTER, THOMAS. DR., 84489 BURGHAUSEN, DE, ROESCH, LUTZ, .. DR., 84489 BURGHAUSEN, DE
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Thermosetting organopolysiloxanes containing a platinum-containing inclusion compound as catalyst, and optionally polysaccharide derivatives are new. The thermosetting organopolysiloxanes contain: (A) organopolysiloxanes with an SiC bonded residue containing multiple aliphatic C-C residues; (B) organopolysiloxanes with an Si-bonded H atom, or, in place of (A) and (B); (C) organopolysiloxanes containing an SiC-bonded residue with multiple aliphatic C-C compounds and an Si-bonded H atom; and (D) a platinum containing inclusion compound, and optionally polysaccharide derivatives selected from starch, amylose, cellulose, and amylopectin. An Independent claim is included for a molded body obtained by crosslinking the organopolysiloxane.